US Patent Issued to Micron Technology on May 13 for "Apparatus including integrated pads and methods of manufacturing the same" (Idaho Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,647, issued on May 13, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatus including integrated pads and methods of manufacturing the same" was invented by Wei Zhou (Boise, Idaho) and Thiagarajan Raman (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including electrically-isolated extensions and associated systems and methods are disclosed herein. An electrically-isolated extension may be coupled to a corresponding connection pad that is attached to a surface of a device. The electrically-isolated extensions may extend at least partially through one or more layers at or near the surface and toward a s...