US Patent Issued to Micron Technology on March 4 for "Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods" (Singaporean, American Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,807, issued on March 4, was assigned to Micron Technology Inc. (Boise, Idaho).

"Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods" was invented by Hong Wan Ng (Singapore), Chin Hui Chong (Singapore), Hem P. Takiar (Fremont, Calif.), Seng Kim Ye (Singapore) and Kelvin Tan Aik Boo (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate includes a first pair and a second pai...