US Patent Issued to Micron Technology on March 18 for "Silicon spacers with improved adhesion and semiconductor device assemblies incorporating the same" (Singaporean Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,128, issued on March 18, was assigned to Micron Technology Inc. (Boise, Idaho).

"Silicon spacers with improved adhesion and semiconductor device assemblies incorporating the same" was invented by Aibin Yu (Singapore) and Yee Chon Chin (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly is provided. The semiconductor device assembly includes a package substrate and a silicon spacer disposed on an upper surface of the substrate, the silicon spacer having a plurality of trenches extending into the silicon spacer from a top surface thereof. The semiconductor device assembly further includes one or more semiconducto...