US Patent Issued to Micron Technology on March 18 for "Microelectronic devices including composite pad structures on staircase structures, and related methods, memory devices, and electronic systems" (Idaho Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,143, issued on March 18, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices including composite pad structures on staircase structures, and related methods, memory devices, and electronic systems" was invented by Alyssa N. Scarbrough (Boise, Idaho), Jordan D. Greenlee (Boise, Idaho) and John D. Hopkins (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device includes a stack structure, a staircase structure, composite pad structures, and conductive contact structures. The stack structure includes vertically alternating conductive structures and insulative structures arranged in tiers. Eac...