ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,198, issued on March 18, was assigned to Micron Technology Inc. (Boise, Idaho).
"Layouts of data pads on a semiconductor die" was invented by Takamasa Suzuki (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Layouts of data pads and dummy data pads are disclosed. A die may include a number of circuits, a first edge, a second edge perpendicular to the first edge, a third edge opposite the first edge, and a fourth edge. The die may further include a first number of data pads variously electrically coupled to the number of circuits and arranged proximate to the first edge and a first number of dummy data pads, not electrically coupled to...