US Patent Issued to Micron Technology on March 18 for "Integrated assemblies and methods of forming integrated assemblies" (Idaho Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,546, issued on March 18, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by Yiping Wang (Boise, Idaho), Andrew Li (Boise, Idaho), Haoyu Li (Boise, Idaho), Matthew J. King (Boise, Idaho), Wei Yeeng Ng (Boise, Idaho) and Yongjun Jeff Hu (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a first structure containing semiconductor material, and having a second structure contacting the first structure. The first structure has a composition along an interface with the second structure. The composition i...