US Patent Issued to Micron Technology on March 18 for "Bond pads for semiconductor die assemblies and associated methods and systems" (American, Japanese, Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,163, issued on March 18, was assigned to Micron Technology Inc. (Boise, Idaho).

"Bond pads for semiconductor die assemblies and associated methods and systems" was invented by Bharat Bhushan (Taichung, Taiwan), Akshay N. Singh (Boise, Idaho), Keizo Kawakita (Hiroshima, Japan) and Bret K. Street (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Bond pads for semiconductor die assemblies, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes a first semiconductor die including a first bond pad on a first side of the first semiconductor die. The semiconductor die assembly further inclu...