US Patent Issued to Micron Technology on March 11 for "Integrated assemblies comprising vertically-stacked decks with interconnected conductive lines" (Idaho Inventor)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,598, issued on March 11, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies comprising vertically-stacked decks with interconnected conductive lines" was invented by Werner Juengling (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a base supporting first circuitry and first conductive lines. The first conductive lines extend along a first direction and are associated with the first circuitry. A deck is over the base and supports an array of memory cells and second conductive lines which are associated with the array of memory cells. The second conducti...