US Patent Issued to Micron Technology on March 11 for "Integrated assemblies and methods of forming integrated assemblies" (Singaporean, American Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,812, issued on March 11, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by Jordan D. Greenlee (Boise, Idaho), Nancy M. Lomeli (Boise, Idaho), John D. Hopkins (Meridian, Idaho), Jiewei Chen (Boise, Idaho), Indra V. Chary (Boise, Idaho), Jun Fang (Boise, Idaho), Vladimir Samara (Boise, Idaho), Kaiming Luo (Singapore), Rita J. Klein (Boise, Idaho), Xiao Li (Boise, Idaho) and Vinayak Shamanna (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a source structure, and having a stack of alternating cond...