US Patent Issued to Micron Technology on March 11 for "Integrated assemblies and methods of forming integrated assemblies" (Italian, American Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,825, issued on March 11, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by Durai Vishak Nirmal Ramaswamy (Boise, Idaho), Marcello Mariani (Milan) and Giorgio Servalli (Fara Gera d'Adda, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a first bottom electrode adjacent to a second bottom electrode. An intervening region is directly between the first and second bottom electrodes. Capacitor-insulative-material is adjacent to the first and second bottom electrodes. The capacitor-insulative-material is subs...