US Patent Issued to Micron Technology on June 24 for "Stacked semiconductor dies for semiconductor device assemblies" (Taiwanese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,128, issued on June 24, was assigned to Micron Technology Inc. (Boise, Idaho).

"Stacked semiconductor dies for semiconductor device assemblies" was invented by Jungbae Lee (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked semiconductor dies for semiconductor device assemblies and associated methods and systems are disclosed. In some embodiments, the semiconductor die assembly includes a substrate with an opening extending therethrough. The assembly can include a stack of semiconductor dies attached to the substrate. The stack includes a first die attached to a front surface of the substrate, where the first die includes a firs...