US Patent Issued to Micron Technology on June 24 for "Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices" (Idaho Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,110, issued on June 24, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices" was invented by Koustav Sinha (Boise, Idaho), Quang Nguyen (Boise, Idaho), Christopher Glancey (Boise, Idaho) and Shams U. Arifeen (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package assembly includes a first mounting surface of a package substrate that faces a second mounting surface of a printed circuit board. A first structural element bond pad is mounted to the first mounting surface. A second structural element bond pad is m...