US Patent Issued to Micron Technology on June 17 for "Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methods" (American, Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,469, issued on June 17, was assigned to Micron Technology Inc. (Boise, Idaho).

"Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methods" was invented by Byung Hoon Moon (Taichung, Taiwan) and Kyle K. Kirby (Eagle, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die is provided, comprising a semiconductor substrate; a dielectric layer over the semiconductor substrate; a bond pad in the dielectric layer, the bond pad including an exposed top surface that is recessed with respect to a surface of the dielectric layer opposite to the semiconductor substrate; and a region of piezoele...