US Patent Issued to Micron Technology on June 17 for "Front end of line interconnect structures and associated systems and methods" (Idaho Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,448, issued on June 17, was assigned to Micron Technology Inc. (Boise, Idaho).

"Front end of line interconnect structures and associated systems and methods" was invented by Kyle K. Kirby (Eagle, Idaho) and Kunal R. Parekh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for a semiconductor device having a front-end-of-line interconnect structure are provided. The semiconductor device may include a dielectric material having a backside formed on a front side of a semiconductor or silicon substrate material and a front side, and a conducting material on the front side of the dielectric material. The conducting material...