US Patent Issued to Micron Technology on July 8 for "Signal routing between memory die and logic die for performing operations" (Washington, California, Idaho Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,649, issued on July 8, was assigned to Micron Technology Inc. (Boise, Idaho).

"Signal routing between memory die and logic die for performing operations" was invented by Aliasger T. Zaidy (Seattle), Sean S. Eilert (Penryn, Calif.), Glen E. Hush (Boise, Idaho) and Kunal R. Parekh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device includes a memory die bonded to a logic die. A logic die that is bonded to a memory die via a wafer-on-wafer bonding process can receive signals indicative of input data from a global data bus of the memory die and through a bond of the logic die and memory die. The logic die can also receive signals...