US Patent Issued to Micron Technology on July 29 for "Microelectronic device packages and related methods and systems" (Malaysian, Singaporean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,612, issued on July 29, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic device packages and related methods and systems" was invented by Kelvin Tan Aik Boo (Penaga, Malaysia), Wen Wei Lum (Kedah, Malaysia) and Hong Wan Ng (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device package includes a microelectronic device, a masking material defined (MMD) contact, and a non-masking material defined (NMMD) contact. The microelectronic device is supported on, and electrically connected to, one of a package substrate and a redistribution layer. The MMD contact is located in a first region of the one of the...