US Patent Issued to Micron Technology on July 29 for "Integrated assemblies and methods of forming integrated assemblies" (Italian Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,330, issued on July 29, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by Marcello Mariani (Milan) and Giorgio Servalli (Fara Gera D'Adda, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having first and second pillars of semiconductor material laterally offset from one another. The pillars have source/drain regions and channel regions vertically offset from the source/drain regions. Gating structures pass across the channel regions, and extend along a first direction. An insulative structure is over regions ...