US Patent Issued to Micron Technology on July 22 for "Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methods" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,131, issued on July 22, was assigned to Micron Technology Inc. (Boise, Idaho).

"Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methods" was invented by Bang-Ning Hsu (Taichung, Taiwan), Kyle K. Kirby (Eagle, Idaho) and Byung Hoon Moon (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die is provided, comprising a semiconductor substrate, a dielectric layer over the semiconductor substrate, a bond pad in the dielectric layer, the bond pad including an exposed top surface that is recessed with respect to a surface of the dielectric layer opposite to the semiconductor su...