US Patent Issued to Micron Technology on July 15 for "Semiconductor devices with flexible spacer including a support structure and methods of making the same" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,247, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor devices with flexible spacer including a support structure and methods of making the same" was invented by Faxing Che (Singapore), Wei Yu (Singapore), Yeow Chon Ong (Singapore), Shin Yueh Yang (Taichung, Taiwan) and Hong Wan Ng (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly includes a semiconductor die, a substrate, and a spacer directly coupled to the substrate. The spacer includes a flexible main body and a support structure embedded in the flexible main body, wherein the support structure has a higher stiffness ...