US Patent Issued to Micron Technology on July 15 for "Semiconductor device assemblies including TSVs of different lengths and methods of making the same" (Idaho Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,243, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assemblies including TSVs of different lengths and methods of making the same" was invented by Kunal R. Parekh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly includes a first semiconductor device having front and rear surfaces, a plurality of front-side pads disposed over the front surface at a first distance from the rear surface, and a plurality of additional device pads disposed over the front surface at a second distance from the rear surface greater than the first distance; a second semiconductor dev...