US Patent Issued to Micron Technology on July 15 for "On-pitch vias for semiconductor devices and associated devices and systems" (Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,915, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"On-pitch vias for semiconductor devices and associated devices and systems" was invented by Hongqi Li (Boise, Idaho) and James A. Cultra (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices with on-pitch vias, and associated systems and methods, are disclosed herein. In one embodiment, the semiconductor device may include a 3-dimensional (3D) cross-point memory array. The semiconductor device also includes access lines for the memory array, which couple with on-pitch vias connected to CMOS circuitry disposed underneath the memory array. In s...