US Patent Issued to Micron Technology on July 15 for "Memory device including circuitry under bond pads" (Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,244, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Memory device including circuitry under bond pads" was invented by Chiara Cerafogli (Boise, Idaho), Kenneth William Marr (Boise, Idaho), Brian J. Soderling (Eagle, Idaho), Michael P. Violette (Boise, Idaho), Joshua Daniel Tomayer (Meridian, Idaho) and James Eric Davis (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion l...