US Patent Issued to Micron Technology on July 15 for "Management of heat on a semiconductor device and methods for producing the same" (Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,259, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Management of heat on a semiconductor device and methods for producing the same" was invented by James S. Rehmeyer (Boise, Idaho) and Christopher G. Wieduwilt (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "An improved memory module and methods for constructing the same are disclosed herein. The memory module includes a substrate having a first surface and a second surface opposite the first surface, each having a central portion, a first array area and a second array area. The first array area is cooler than the second array area during operation. The memor...