US Patent Issued to Micron Technology on July 15 for "Integrated assemblies and methods of forming integrated assemblies" (Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,895, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by Justin B. Dorhout (Boise, Idaho), Kunal R. Parekh (Boise, Idaho), Martin C. Roberts (Boise, Idaho), Mohd Kamran Akhtar (Boise, Idaho), Chet E. Carter (Boise, Idaho) and David Daycock (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly with a semiconductor channel material having a boundary region where a more-heavily-doped region interfaces with a less-heavily-doped region. The more-heavily-doped region and the less-heavily-doped re...