US Patent Issued to Micron Technology on July 15 for "Cross stack bridge bonding devices and associated methods" (Singaporean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,319, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Cross stack bridge bonding devices and associated methods" was invented by Seng Kim Ye (Singapore), Kelvin Tan Aik Boo (Singapore), Hong Wan Ng (Singapore) and Chin Hui Chong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package having a package substrate including an upper surface, a controller, a first die stack, and a second die stack. The controller, the first die stack, and the second die stack are at the upper surface. The first die stack includes a first shingled sub-stack and a first reverse-shingled sub-stack. The first die stack also...