US Patent Issued to Micron Technology on July 15 for "Apparatus including direct-contact heat paths and methods of manufacturing the same" (Singaporean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,255, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatus including direct-contact heat paths and methods of manufacturing the same" was invented by Kelvin Tan Aik Boo (Singapore), Hong Wan Ng (Singapore), Seng Kim Ye (Singapore) and Chin Hui Chong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including thermally conductive structures are disclosed herein. A heat transfer structure may be thermally coupled to a semiconductor device and directly attached to a signaling layer of a substrate. The heat transfer structure may be configured to remove thermal energy from the semiconductor de...