US Patent Issued to Micron Technology on July 15 for "Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods" (Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,311, issued on July 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods" was invented by Eiichi Nakano (Boise, Idaho) and Mark E. Tuttle (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "An anisotropic conductive film (ACF) is formed with an ordered array of discrete regions that include a conductive carbon-based material. The discrete regions, which may be formed at small pitch, are embedded in at least one adhesive dielectric material. The ACF may be used to mechanically and electrically i...