US Patent Issued to Micron Technology on July 1 for "Systems and methods for mitigating crack propagation in semiconductor die manufacturing" (American, Irish Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,732, issued on July 1, was assigned to Micron Technology Inc. (Boise, Idaho).

"Systems and methods for mitigating crack propagation in semiconductor die manufacturing" was invented by Wei Yeeng Ng (Boise, Idaho), Rajesh Balachandran (Douglas, Ireland), Frank Speetjens (Boise, Idaho), Andrew L. Li (Boise, Idaho), Sukhdeep Kaur (Boise, Idaho) and Sangeetha P. Komanduri (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for mitigating crack propagation during manufacture of semiconductor dies, and associated systems and methods are disclosed herein. The method includes forming holes into a first side of a wafer substrate opposite a se...