US Patent Issued to Micron Technology on July 1 for "Semiconductor components having conductive vias with aligned back side conductors" (California, Idaho Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,731, issued on July 1, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor components having conductive vias with aligned back side conductors" was invented by Jin Li (Meridian, Idaho) and Tongbi Jiang (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in el...