US Patent Issued to Micron Technology on Jan. 28 for "Substrate-free semiconductor device assemblies with multiple semiconductor devices and methods for making the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,798, issued on Jan. 28, was assigned to Micron Technology Inc. (Boise, Idaho).

"Substrate-free semiconductor device assemblies with multiple semiconductor devices and methods for making the same" was invented by Hung Wen Liu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly includes a first remote distribution layer (RDL), the first RDL comprising a lower outermost planar surface of the semiconductor device assembly; a first semiconductor die directly coupled to an upper surface of the first RDL by a first plurality of interconnects; a second RDL, the second RDL comprising an upper outermost planar surf...