US Patent Issued to Micron Technology on Jan. 27 for "Signal routing structures including a plurality of parallel conductive lines and semiconductor device assemblies including the same" (Idaho Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,821, issued on Jan. 27, was assigned to Micron Technology Inc. (Boise, Idaho).

"Signal routing structures including a plurality of parallel conductive lines and semiconductor device assemblies including the same" was invented by Kunal R. Parekh (Boise, Idaho) and James B. Johnson (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly includes a first semiconductor device having a first plurality of electrical contacts with a first average pitch, a second semiconductor device over the first semiconductor device and having a second plurality of electrical contacts with a second average pitch, and a signal routing ...