US Patent Issued to Micron Technology on Jan. 20 for "Stacked capacitors for semiconductor devices and associated systems and methods" (Singaporean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,781, issued on Jan. 20, was assigned to Micron Technology Inc. (Boise, Idaho).

"Stacked capacitors for semiconductor devices and associated systems and methods" was invented by Seng Kim Ye (Singapore), Kelvin Tan Aik Boo (Singapore), Hong Wan Ng (Singapore) and Chin Hui Chong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die...