ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,774, issued on Jan. 20, was assigned to Micron Technology Inc. (Boise, Idaho).
"Conductive organic module for semiconductor devices and associated systems and methods" was invented by Jungbae Lee (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device can include a package substrate and a stack of semiconductor dies carried by the package substrate. The stack of semiconductor dies includes a first die carried by the package substrate and a second die carried by the first die. The semiconductor device also incl...