US Patent Issued to Micron Technology on Jan. 13 for "Techniques to manufacture inter-layer vias" (Singaporean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,530, issued on Jan. 13, was assigned to Micron Technology Inc. (Boise, Idaho).

"Techniques to manufacture inter-layer vias" was invented by Jun Rong Tan (Singapore), Keen Wah Chow (Singapore), Hao Ting Teo (Singapore) and Hoong Shing Wong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for techniques to manufacture inter-layer vias are described. In some examples, a manufacturing process for a via to one or more metal lines within an integrated circuit may not include forming a metal pad for the via. For example, the manufacturing process may include forming a layer of dielectric material over a set of metal l...