US Patent Issued to Micron Technology on Jan. 13 for "Package substrate for a semiconductor device" (Singaporean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,521, issued on Jan. 13, was assigned to Micron Technology Inc. (Boise, Idaho).

"Package substrate for a semiconductor device" was invented by Seng Kim Ye (Singapore), Kelvin Tan Aik Boo (Singapore), Hong Wan Ng (Singapore) and Chin Hui Chong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "This document discloses techniques, apparatuses, and systems relating to a package substrate for a semiconductor device. A semiconductor device assembly is described that includes a packaged semiconductor device having one or more semiconductor dies coupled to a package-level substrate. The package-level substrate has a first surface at which first contac...