ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,342, issued on Jan. 13, was assigned to Micron Technology Inc. (Boise, Idaho).
"Memory with post-packaging master die selection" was invented by Evan C. Pearson (Boise, Idaho), John H. Gentry (Boise, Idaho), Michael J. Scott (Boise, Idaho), Greg S. Gatlin (Mountain Home, Idaho), Lael H. Matthews (Meridian, Idaho), Anthony M. Geidl (Boise, Idaho), Michael Roth (Boise, Idaho), Markus H. Geiger (Boise, Idaho) and Dale H. Hiscock (Boise, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "Memory devices and systems with post-packaging master die selection, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plura...