ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,816, issued on Feb. 4, was assigned to Micron Technology Inc. (Boise, Idaho).
"Semiconductor wiring device and method" was invented by Hidenori Yamaguchi (Higashihiroshima, Japan) and Keizo Kawakita (Higashi Hiroshima, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus and methods are disclosed, including transistors, semiconductor devices and systems. Example semiconductor devices and methods include a first transmission line and a second transmission line located over one another. A via is shown connecting the first transmission line and a second transmission line wherein a first side of the via and a side of the second transmission lin...