US Patent Issued to Micron Technology on Feb. 4 for "Radiation hardened semiconductor devices and packaging" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,103, issued on Feb. 4, was assigned to Micron Technology Inc. (Boise, Idaho).

"Radiation hardened semiconductor devices and packaging" was invented by Chong Leong Gan (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Radiation hard semiconductor devices and packaging are disclosed. A semiconductor device assembly includes a substrate, a semiconductor die stack electrically coupled to the substrate, and an ionizing radiation shield disposed over a top die of the semiconductor die stack, wherein the ionizing radiation shield comprises silicon carbide (SiC). The semiconductor device assembly further includes an encapsulant at least partia...