US Patent Issued to Micron Technology on Feb. 4 for "Component inter-digitated vias and leads" (California Inventor)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,056, issued on Feb. 4, was assigned to Micron Technology Inc. (Boise, Idaho).

"Component inter-digitated vias and leads" was invented by Christopher Kinney (Folsom, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure are directed to systems and methods to reduce inductance on an integrated circuit package of a memory sub-system. A memory sub-system is also hereinafter referred to as a "memory device." An example of a memory sub-system is a storage system, such as a SSD, and can be embodied as an integrated circuit package, including but not limited to a pin grid array (PGA), and ball grid array (BGA)."

The patent ...