US Patent Issued to Micron Technology on Feb. 3 for "Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,583, issued on Feb. 3, was assigned to Micron Technology Inc. (Boise, Idaho).

"Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules" was invented by Jong Sik Paek (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked die modules for semiconductor device assemblies and methods of manufacturing the modules are disclosed. In some embodiments, the module includes a shingled stack of semiconductor dies, each die having an uncovered porch with bond pads. Further, a dielectric structure partially encapsulates the shingled stack of semiconductor dies. The dielectric structure includes ope...