US Patent Issued to Micron Technology on Feb. 3 for "Semiconductor systems with anti-warpage mechanisms and associated systems, devices, and methods" (Idaho Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,572, issued on Feb. 3, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor systems with anti-warpage mechanisms and associated systems, devices, and methods" was invented by Quang Nguyen (Boise, Idaho), Christopher Glancey (Boise, Idaho) and Koustav Sinha (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor systems having anti-warpage frames (and associated systems, devices, and methods) are described herein. In one embodiment, a semiconductor system includes (a) a printed circuit board (PCB) having a first side and a second side opposite the first side, and (b) at least one memory device attached to the PCB at...