US Patent Issued to Micron Technology on Feb. 3 for "Power management across multiple packages of memory dies" (Idaho Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,170, issued on Feb. 3, was assigned to Micron Technology Inc. (Boise, Idaho).

"Power management across multiple packages of memory dies" was invented by Liang Yu (Boise, Idaho), Jeremy Wayne Butterfield (Meridian, Idaho) and Jeremy Binfet (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A variety of applications can include multiple memory die packages configured to engage in peak power management (PPM) across the multiple packages of memory dies. A communication line coupled to each memory die in the multiple memory die packages can be used to facilitate the PPM. A global management die can start a communication sequence among the multip...