US Patent Issued to Micron Technology on Feb. 25 for "Through stack bridge bonding devices and associated methods" (Singaporean Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,301, issued on Feb. 25, was assigned to Micron Technology Inc. (Boise, Idaho).

"Through stack bridge bonding devices and associated methods" was invented by Chin Hui Chong (Singapore), Seng Kim Ye (Singapore), Kelvin Tan Aik Boo (Singapore) and Hong Wan Ng (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a package substrate with an upper surface, a controller, and a die stack. The controller and the die stack are at the upper surface. The die stack includes a shingled sub-stack of semiconductor dies, a reverse-shingled sub-stack of semiconductor dies, and a bridging chip. The bridging chip is bonded between...