US Patent Issued to Micron Technology on Feb. 25 for "Systems and methods for direct bonding in semiconductor die manufacturing" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,299, issued on Feb. 25, was assigned to Micron Technology Inc. (Boise, Idaho).

"Systems and methods for direct bonding in semiconductor die manufacturing" was invented by Chia Jung Hsu (Taichung, Taiwan) and Eiichi Nakano (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked semiconductor device and systems and methods for producing the same are disclosed here. In some embodiments, the method includes aligning a first array of bond pads on an upper surface of a first semiconductor substrate with a second array of bond pads on a lower surface of a second semiconductor substrate. The method then includes annealing the stacked semicond...