ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,444, issued on Dec. 9, was assigned to Micron Technology Inc. (Boise, Idaho).
"Semiconductor device with tunable antenna using wire bonds" was invented by Shijian Luo (Boise, Idaho) and Owen R. Fay (Meridian, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device, or semiconductor device package, that includes a substrate having an antenna structure on a surface of the substrate and a wire bond that electrically connects the antenna structure to the substrate to form an antenna or a first antenna configuration. The substrate may include a second antenna structure with the wire bond connected to the second antenna structure formin...