US Patent Issued to Micron Technology on Dec. 30 for "Thin die release for semiconductor device assembly" (Idaho Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,368, issued on Dec. 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Thin die release for semiconductor device assembly" was invented by Andrew M. Bayless (Boise, Idaho) and Brandon P. Wirz (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for releasing thinned semiconductor dies from a mount tape and associated apparatuses are disclosed. In one embodiment, a sacrificial layer may be disposed at a back side of thinned substrate including semiconductor dies. The sacrificial layer includes materials soluble in contact with a fluid (and/or vapor). A sheet of perforated mount tape may be attached to the sacrificial layer an...