US Patent Issued to Micron Technology on Dec. 30 for "Semiconductor device assemblies with balanced wires, and associated methods" (Singaporean, American Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,437, issued on Dec. 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assemblies with balanced wires, and associated methods" was invented by Chin Hui Chong (Singapore), Hong Wan Ng (Singapore) and Suresh K. Upadhyayula (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An assembly comprising a substrate with a first and second bond pad at a top surface; and a semiconductor die with a lower surface coupled to the top surface, an upper surface with a third and fourth bond pad thereat, and a side surface perpendicular to the upper and lower surfaces. The first bond pad can be a first distance, the second bo...