US Patent Issued to Micron Technology on Dec. 30 for "Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,332, issued on Dec. 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems" was invented by Brandon P. Wirz (Boise, Idaho) and Liang Chun Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Encapsulation warpage reduction for semiconductor die assemblies, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes an interface die, a stack of semiconductor dies attached to a surface of the interface die, where the stack of semiconductor dies has a first height from the surface. The ...