US Patent Issued to Micron Technology on Dec. 23 for "Perpendicular semiconductor device assemblies and associated methods" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,118, issued on Dec. 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Perpendicular semiconductor device assemblies and associated methods" was invented by Brandon P. Wirz (Boise, Idaho), Andrew M. Bayless (Boise, Idaho), Owen R. Fay (Meridian, Idaho) and Bang-Ning Hsu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly can include an assembly semiconductor die having a top surface with a first and a second assembly communication element thereat. The semiconductor device assembly can further include a semiconductor die stack coupled to the top surface. The die stack can include a first and a sec...