US Patent Issued to Micron Technology on Dec. 23 for "Integrated assemblies and methods of forming integrated assemblies" (Idaho Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,405, issued on Dec. 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by Jordan D. Greenlee (Boise, Idaho), Alyssa N. Scarbrough (Boise, Idaho) and John D. Hopkins (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a memory region and another region adjacent the memory region. Channel-material-pillars are arranged within the memory region, and conductive posts are arranged within said other region. A source structure is coupled to lower regions of the channel-material-pillars. A panel extends ...